認識19英寸機箱與機柜

　　Get to know 19 inch chassis and cabinets

　　一、什么是19英寸機箱？19英寸機箱是一種專門設(shè)計用來安裝在19英寸機柜中的設(shè)備。機柜主要分為兩種：Cabinet（機柜）：四周有外殼和頂蓋，提供較好的保護。Rack（機架）：沒有外殼，結(jié)構(gòu)更簡單。19英寸機箱通常設(shè)計成長方體，并遵循統(tǒng)一的高度標(biāo)準(zhǔn)，這樣不同廠家生產(chǎn)的機箱都能安裝到符合規(guī)格的機柜中。

　　1、 What is a 19 inch chassis? A 19 inch chassis is a device specifically designed to be installed in a 19 inch cabinet. Cabinets are mainly divided into two types: Cabinet: surrounded by a shell and a top cover, providing better protection. Rack: Without a casing, the structure is simpler. A 19 inch chassis is usually designed as a long cube and follows a uniform height standard, so that chassis produced by different manufacturers can be installed in cabinets that meet specifications.

　　二、19英寸機箱和機柜的由來這種規(guī)格初源于美國軍方的電子設(shè)備標(biāo)準(zhǔn)，目的是統(tǒng)一設(shè)備尺寸，方便快速安裝、更換和維護。后來，這項技術(shù)被民用行業(yè)廣泛采用，尤其是工業(yè)控制和網(wǎng)絡(luò)設(shè)備領(lǐng)域。三、19英寸機箱的種類19英寸機箱主要分為兩大類：1. 辦公室用產(chǎn)品服務(wù)器（Server）電信設(shè)備（Telcom）網(wǎng)絡(luò)設(shè)備（Internet/Intranet）其他計算機周邊產(chǎn)品2. 工業(yè)用產(chǎn)品工業(yè)計算機（IPC）控制面板（Control Panel）其他機器輔助設(shè)備四、機柜的規(guī)格機柜的尺寸遵循國際標(biāo)準(zhǔn)（如IEC-60297和EIA-310），主要包括三個方面：1. 高度（單位：U）1U = 1.75英寸（約44.45毫米）機柜的高度用“U”表示，例如35U的機柜可以安裝總高度為35U的機箱。2. 寬度標(biāo)準(zhǔn)寬度為19英寸（約482.6毫米），但機柜的實際內(nèi)部寬度通常為450毫米左右，以便安裝機箱。常見的機柜寬度為600毫米。3. 深度深度沒有嚴格限制，常見的有600毫米、700毫米和800毫米。機箱的深度一般建議小于450毫米，以便留出空間散熱和布線。19英寸機箱的深度制造：工藝與方法詳解步：設(shè)計與規(guī)劃——制造的藍圖在任何制造開始之前，精密的設(shè)計是成功的基石。三維結(jié)構(gòu)設(shè)計：使用CAD軟件進行3D建模，確定機箱的長、寬、高、U數(shù)，并精確規(guī)劃主板安裝孔、擴展卡槽、通風(fēng)孔、接口開口等所有細節(jié)。此時必須充分考慮EIA-310-D或IEC-60297等標(biāo)準(zhǔn)中對安裝孔距、面板尺寸的嚴格要求。板材展開設(shè)計：將3D模型“展開”成2D平面圖，為后續(xù)的激光切割做準(zhǔn)備。需要精確計算折彎處的拉伸和補償，確保折彎后尺寸準(zhǔn)確。工藝規(guī)劃：確定每個零件的加工順序，例如先沖孔后折彎，還是先折彎后攻絲。

　　2、 The origin of 19 inch chassis and cabinets originated from the electronic equipment standards of the US military, with the aim of unifying equipment dimensions, facilitating quick installation, replacement, and maintenance. Later, this technology was widely adopted by the civilian industry, especially in the fields of industrial control and network equipment. 3、 There are two main types of 19 inch chassis: 1 Office products: Server, Telcom, Internet/Intranet, and other computer peripheral products. Industrial products: IPC, Control Panel, and other machine auxiliary equipment. Cabinet specifications: The size of the cabinet follows international standards (such as IEC-60297 and EIA-310), mainly including three aspects: 1 Height (unit: U) 1U=1.75 inches (approximately 44.45 millimeters) The height of a cabinet is represented by "U", for example, a 35U cabinet can accommodate a chassis with a total height of 35U. 2. The standard width is 19 inches (approximately 482.6 millimeters), but the actual internal width of the cabinet is usually around 450 millimeters for installing the chassis. The common cabinet width is 600 millimeters. 3. There is no strict limit on depth, and common ones are 600 millimeters, 700 millimeters, and 800 millimeters. The depth of the chassis is generally recommended to be less than 450 millimeters to leave space for heat dissipation and wiring. Deep Manufacturing of 19 inch Chassis: Process and Method Explanation Step 1: Design and Planning - The Blueprint for Manufacturing Before any manufacturing begins, precise design is the cornerstone of success. 3D structural design: Use CAD software for 3D modeling, determine the length, width, height, and number of U of the chassis, and accurately plan all details such as motherboard mounting holes, expansion card slots, ventilation holes, interface openings, etc. At this point, it is necessary to fully consider the strict requirements for installation hole spacing and panel size in standards such as EIA-310-D or IEC-60297. Plate unfolding design: Unfold the 3D model into a 2D plan view to prepare for subsequent laser cutting. Accurate calculation of stretch and compensation at the bend is required to ensure accurate dimensions after bending. Process planning: Determine the processing sequence of each part, such as punching first and then bending, or bending first and then tapping.

　　第二步：鈑金加工——從板材到零件這是機箱制造的核心環(huán)節(jié)，主要包括下料、沖壓/鉆孔和折彎。下料激光切割：這是目前主流、精密的方法。高功率激光束按照CAD圖紙的路徑對金屬板材（通常是冷軋鋼SPCC或鋁合金）進行切割。優(yōu)點在于切割精度高、切口光滑、靈活性強，可以輕松切割出各種復(fù)雜的通風(fēng)網(wǎng)孔和IO接口形狀。數(shù)控沖床：適用于大批量、標(biāo)準(zhǔn)化孔位的加工，效率高。但對于復(fù)雜圖形的靈活性不如激光切割?，F(xiàn)代制造中常采用激光切割與數(shù)控沖床結(jié)合的復(fù)合機，一次性完成大部分加工。成型折彎：使用數(shù)控折彎機對切割好的板材進行彎曲。操作員根據(jù)設(shè)計圖紙編程，機器通過上模和下模的配合，對板材施加壓力，形成精確角度的彎折。折彎的順序和精度直接決定了機箱結(jié)構(gòu)的準(zhǔn)確性和強度。沖壓：用于制作一些特定形狀，如加強筋（增加板材剛性）、機箱的安裝耳朵、快速拆裝彈片等。螺紋加工對于需要螺絲固定的位置（如安裝主板、電源），需要進行螺紋加工。攻絲：在預(yù)先鉆好的孔內(nèi)加工出內(nèi)螺紋。壓鉚：預(yù)先將專用的螺母（如壓鉚螺母）或螺柱通過壓力機牢固地壓入板材中，形成強度高、不易滑牙的螺紋孔。這是高質(zhì)量機箱的常見工藝。

　　Step 2: Sheet metal processing - from sheet metal to parts, this is the core process of chassis manufacturing, mainly including cutting, stamping/drilling, and bending. Laser cutting for cutting: This is currently the most mainstream and precise method. High power laser beams cut metal sheets (usually cold-rolled steel SPCC or aluminum alloys) according to the path of CAD drawings. The advantages are high cutting accuracy, smooth incision, and strong flexibility, which can easily cut various complex ventilation mesh holes and IO interface shapes. CNC punching machine: suitable for processing large quantities and standardized hole positions, with high efficiency. But its flexibility for complex shapes is not as good as laser cutting. In modern manufacturing, a composite machine combining laser cutting and CNC punching is often used to complete most of the processing in one go. Forming bending: Use a CNC bending machine to bend the cut sheet metal. The operator programs according to the design drawings, and the machine applies pressure to the sheet metal through the coordination of the upper and lower molds, forming precise angle bending. The order and accuracy of bending directly determine the accuracy and strength of the chassis structure. Stamping: used to make specific shapes, such as reinforcing ribs (to increase the rigidity of the board), installation ears for chassis, quick disassembly and assembly of spring clips, etc. Threading processing is required for positions that require screw fixation, such as installing motherboards or power supplies. Tapping: Machining internal threads into pre drilled holes. Riveting: Pre press a specialized nut (such as a rivet nut) or bolt firmly into the plate using a press, forming a high-strength, non slip threaded hole. This is a common process for high-quality chassis.

　　第三步：焊接與組裝——將零件整合為一體對于結(jié)構(gòu)復(fù)雜的機箱，部分部件需要通過焊接來連接。二氧化碳保護焊或氬弧焊：用于機箱主體框架的焊接，能提供較高的連接強度。點焊：適用于薄板之間的連接，熱變形小。注意：焊接后通常需要進行校形處理，以焊接帶來的應(yīng)力變形，并打磨焊點，使其平整美觀。

　　Step 3: Welding and Assembly - Integrate the parts into one. For complex chassis structures, some components need to be connected by welding. Carbon dioxide shielded welding or argon arc welding: used for welding the main frame of the chassis, which can provide high connection strength. Spot welding: suitable for connecting thin plates with minimal thermal deformation. Attention: After welding, it is usually necessary to perform shape correction treatment to eliminate stress deformation caused by welding, and polish the welding points to make them flat and beautiful.

　　第四步：表面處理——防護與美觀表面處理關(guān)重要，它能防止金屬生銹、腐蝕，并賦予機箱終的外觀。前處理：包括脫脂（去除油污）、酸洗（去除銹跡）和磷化（在金屬表面形成一層磷酸鹽保護膜，增強油漆附著力）。噴涂：粉末噴涂：這是機箱常用的表面處理方式。通過靜電吸附將干燥的塑料粉末附著在工件表面，然后經(jīng)過高溫烘烤，粉末熔融固化形成一層堅固、耐用、美觀的涂層。優(yōu)點是無溶劑、、涂層厚、耐磨耐腐蝕。電泳：主要用于底漆，提供均勻的防銹保護。其他處理：絲網(wǎng)印刷：在機箱面板上印刷Logo、指示燈標(biāo)識、接口名稱等。陽極氧化：主要用于鋁合金機箱，形成一層堅硬、耐磨、耐腐蝕的氧化層，并可染成各種顏色。

　　Step 4: Surface Treatment - Protective and Aesthetic Surface treatment is crucial as it can prevent metal rusting and corrosion, and give the chassis its final appearance. Pre treatment: including degreasing (removing oil stains), acid washing (removing rust), and phosphating (forming a layer of phosphate protective film on the metal surface to enhance paint adhesion). Spray coating: Powder coating: This is the most commonly used surface treatment method for chassis. Dry plastic powder is attached to the surface of the workpiece through electrostatic adsorption, and then baked at high temperature. The powder melts and solidifies to form a strong, durable, and aesthetically pleasing coating. The advantages are solvent-free, environmentally friendly, thick coating, and wear and corrosion resistance. Electrophoresis: mainly used for primer, providing uniform rust protection. Other processing: Screen printing: Printing logos, indicator lights, interface names, etc. on the chassis panel. Anodizing: mainly used for aluminum alloy chassis to form a hard, wear-resistant, and corrosion-resistant oxide layer, which can be dyed in various colors.

　　第五步：總裝與檢驗——終的質(zhì)量關(guān)卡總裝：將經(jīng)過表面處理的所有金屬結(jié)構(gòu)件、預(yù)先采購的標(biāo)準(zhǔn)件（如硬盤架、風(fēng)扇、導(dǎo)軌、把手、腳墊）和絕緣件（如主板銅柱）按照工藝要求組裝起來。電磁兼容性設(shè)計：高端機箱會在此環(huán)節(jié)安裝EMI彈片。這些彈片通常由鈹銅制成，具有良好的導(dǎo)電性和彈性，安裝在機箱蓋板與主體的接合處，用于屏蔽內(nèi)部電子設(shè)備產(chǎn)生的高頻電磁輻射，防止其泄漏干擾其他設(shè)備，也防止外部干擾進入。終檢驗：尺寸檢驗：使用卡尺、高度規(guī)等工具檢驗關(guān)鍵安裝尺寸是否符合標(biāo)準(zhǔn)。外觀檢驗：檢查表面是否有劃傷、色差、臟污等瑕疵。裝配檢驗：模擬安裝主板、擴展卡等，檢查是否存在干涉，螺絲孔位是否對齊。接地電阻測試：檢驗機箱的接地是否良好，確保使用。

　　Step 5: Assembly and Inspection - Final Quality Level Assembly: Assemble all surface treated metal structural components, pre purchased standard components (such as hard drive racks, fans, rails, handles, floor mats), and insulation components (such as motherboard copper columns) according to process requirements. Electromagnetic compatibility design: High end chassis will install EMI shrapnel at this stage. These shrapnel are usually made of beryllium copper, which has good conductivity and elasticity. They are installed at the junction of the chassis cover and the main body to shield the high-frequency electromagnetic radiation generated by internal electronic devices, prevent leakage and interference with other devices, and also prevent external interference from entering. Final inspection: Dimensional inspection: Use tools such as calipers and height gauges to check whether the key installation dimensions meet the standards. Appearance inspection: Check the surface for scratches, color differences, dirt, and other defects. Assembly inspection: Simulate the installation of motherboards, expansion cards, etc., and check for interference and alignment of screw holes. Grounding resistance test: Check whether the grounding of the chassis is good to ensure safe use.

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